3-D vertical solenoid inductors by electrodeposition techniques

On-chip spiral inductors suffer from substrate loss and parasitics, also have large footprints. This paper presents three-dimensional (3-D) vertical solenoid inductors by electro deposition technique. Metal ground shield inserted in the oxide layer to terminate electric field to enter inside substrate. Compared to on-chip spiral inductors, capacitive energy loss can be reduced about 60% and power loss about 90% in our proposed method.