Corresponding author

Qi Zhang; Zhichao Li; Houjun Qi; Zhichao Li; Zhenyun Chu

Corresponding author

Qi Zhang, Zhichao Li, Houjun Qi, Zhichao Li, Zhenyun Chu

Industrial and Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface to obtain wafers with required flatness and surface quality. Wafer flatness has a great effect on the photolithographic system's ability to print integrated circuit features. In this paper, a surface element method is used to develop a mathematic model to predict the wafer flatness, which are parameterized and quantified by total thickness variation (TTV) and Bow. Results show that the model effectively simulates the CMP process and predicts the wafer flatness.

Original language	English
Title of host publication	Unknown book
Pages	pp. 1-2
Volume	2021
State	Published - 2021

Cite this

@inproceedings{4a4f5d8d30794e89a6d7913045700013,

title = "Corresponding author",

abstract = "Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface to obtain wafers with required flatness and surface quality. Wafer flatness has a great effect on the photolithographic system's ability to print integrated circuit features. In this paper, a surface element method is used to develop a mathematic model to predict the wafer flatness, which are parameterized and quantified by total thickness variation (TTV) and Bow. Results show that the model effectively simulates the CMP process and predicts the wafer flatness.",

author = "Qi Zhang and Zhichao Li and Houjun Qi and Zhichao Li and Zhenyun Chu",

year = "2021",

language = "English",

volume = "2021",

pages = "pp. 1--2",

booktitle = "Unknown book",

}

TY - GEN

T1 - Corresponding author

AU - Zhang, Qi

AU - Li, Zhichao

AU - Qi, Houjun

AU - Li, Zhichao

AU - Chu, Zhenyun

PY - 2021

Y1 - 2021

N2 - Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface to obtain wafers with required flatness and surface quality. Wafer flatness has a great effect on the photolithographic system's ability to print integrated circuit features. In this paper, a surface element method is used to develop a mathematic model to predict the wafer flatness, which are parameterized and quantified by total thickness variation (TTV) and Bow. Results show that the model effectively simulates the CMP process and predicts the wafer flatness.

AB - Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface to obtain wafers with required flatness and surface quality. Wafer flatness has a great effect on the photolithographic system's ability to print integrated circuit features. In this paper, a surface element method is used to develop a mathematic model to predict the wafer flatness, which are parameterized and quantified by total thickness variation (TTV) and Bow. Results show that the model effectively simulates the CMP process and predicts the wafer flatness.

M3 - Conference contribution

VL - 2021

SP - 1

EP - 2

BT - Unknown book

ER -

Corresponding author

Abstract

Fingerprint

Cite this