Abstract
The silicon carbide (SiC) waffle-substrate n-channel insulated gate bipolar transistor (IGBT) is a vertical IGBT designed to operate at blocking voltages below about 15 kV. At these voltages, the drift and anode layers are too thin to allow complete removal of the n + substrate. Instead, a waffle pattern is etched through the substrate to expose the buried anode layer while preserving the structural integrity of the wafer. The feasibility of this approach is demonstrated by fabricating a 10-kV class n-channel IGBT with a differential specific ON-resistance of 160 m Ω cm 2.
| Original language | English |
|---|---|
| Pages (from-to) | 5683-5688 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 69 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 1 2022 |
Keywords
- 10-kV class
- 4H-SiC
- differential specific on-resistance
- IGBT
- laser annealing
- waffle substrate