Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape

ZC Li; Emmanuel A. Baisie; Xiaohong Zhang

doi:10.1016/j.precisioneng.2011.10.006

Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape

ZC Li
, Emmanuel A. Baisie
, Xiaohong Zhang

Industrial and Systems Engineering

Research output: Contribution to journal › Article › peer-review

39 Scopus citations

Abstract

Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface. In CMP, a diamond disc conditioner is employed to condition (or dress) a polishing pad to restore the pad planarity and surface roughness. In this paper, a surface element method is proposed to develop a mathematic model to predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Results show that the model effectively simulates diamond disc conditioning and predicts the pad surface shape. © 2011 Elsevier Inc. All rights reserved.

Original language	English
Pages (from-to)	356-363
Number of pages	8
Journal	Precision Engineering
Volume	36
Issue number	2
DOIs	https://doi.org/10.1016/j.precisioneng.2011.10.006
State	Published - Apr 1 2012

Keywords

Abrasives
Chemical mechanical planarization
Conditioning
Dressing
Kinematic analysis
Mathematic model
Semiconductor materials

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10.1016/j.precisioneng.2011.10.006

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abstract = "Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface. In CMP, a diamond disc conditioner is employed to condition (or dress) a polishing pad to restore the pad planarity and surface roughness. In this paper, a surface element method is proposed to develop a mathematic model to predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Results show that the model effectively simulates diamond disc conditioning and predicts the pad surface shape. {\textcopyright} 2011 Elsevier Inc. All rights reserved.",

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AU - Li, ZC

AU - Baisie, Emmanuel A.

AU - Zhang, Xiaohong

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Y1 - 2012/4/1

N2 - Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface. In CMP, a diamond disc conditioner is employed to condition (or dress) a polishing pad to restore the pad planarity and surface roughness. In this paper, a surface element method is proposed to develop a mathematic model to predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Results show that the model effectively simulates diamond disc conditioning and predicts the pad surface shape. © 2011 Elsevier Inc. All rights reserved.

AB - Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface. In CMP, a diamond disc conditioner is employed to condition (or dress) a polishing pad to restore the pad planarity and surface roughness. In this paper, a surface element method is proposed to develop a mathematic model to predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Results show that the model effectively simulates diamond disc conditioning and predicts the pad surface shape. © 2011 Elsevier Inc. All rights reserved.

KW - Abrasives

KW - Chemical mechanical planarization

KW - Conditioning

KW - Dressing

KW - Kinematic analysis

KW - Mathematic model

KW - Semiconductor materials

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Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape

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Keywords

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