Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	ASME 2011 International Manufacturing Science and Engineering Conference
Pages	175–184
State	Published - 2011

Cite this

@inproceedings{84683d3460c9464b9b8f28f5ff1975d9,

title = "Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape",

author = "ZC Li and Baisie, \{Emmanuel A\} and XH Zhang",

year = "2011",

language = "English",

pages = "175–184",

booktitle = "ASME 2011 International Manufacturing Science and Engineering Conference",

}