TY - GEN
T1 - Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy
AU - Abbasi, S.
AU - Aravamudhan, Shyam
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/25
Y1 - 2017/7/25
N2 - In nano-domains, particles of different sizes and surface morphologies affect the properties of materials and its matrix environment uniquely compared to larger size particles. Reducing particle size increases the surface area in contact with the surrounding matrix material such as epoxy resin, along with higher drag and viscosity. Hence, nanoparticles can be exploited to enhance and alter the properties of materials distinctively. Hexagonal boron nitride (hBN) particles of various sizes (1.5μm, 500nm and 70nm) were employed in the fabrication of underfills to investigate the effect of particle size (and surface to volume ratio) on its thermal properties. Filler loadings of 1% to 5% volume fractions were used to prepare underfills using EPON™ Resin 826 and Epikure 3140. The experimental results exhibited that thermal properties of underfills is altered depending upon filler content and particle size. Thermal conductivity of 0.3W/mK was obtained at 5% volume fraction of 70nm hBN filler loading. Furthermore, the influence of filler size and loading on the glass transition temperature (Tg) of the adhesive were studied.
AB - In nano-domains, particles of different sizes and surface morphologies affect the properties of materials and its matrix environment uniquely compared to larger size particles. Reducing particle size increases the surface area in contact with the surrounding matrix material such as epoxy resin, along with higher drag and viscosity. Hence, nanoparticles can be exploited to enhance and alter the properties of materials distinctively. Hexagonal boron nitride (hBN) particles of various sizes (1.5μm, 500nm and 70nm) were employed in the fabrication of underfills to investigate the effect of particle size (and surface to volume ratio) on its thermal properties. Filler loadings of 1% to 5% volume fractions were used to prepare underfills using EPON™ Resin 826 and Epikure 3140. The experimental results exhibited that thermal properties of underfills is altered depending upon filler content and particle size. Thermal conductivity of 0.3W/mK was obtained at 5% volume fraction of 70nm hBN filler loading. Furthermore, the influence of filler size and loading on the glass transition temperature (Tg) of the adhesive were studied.
KW - Cure behavior of epoxy
KW - Encapsulants
KW - Glass transition temperature
KW - Heat capacity
KW - Microelectronics packaging
KW - Nanofillers
KW - Thermal conductivity
KW - Thermal diffusivity
UR - https://www.scopus.com/pages/publications/85034447775
U2 - 10.1109/ITHERM.2017.7992479
DO - 10.1109/ITHERM.2017.7992479
M3 - Conference contribution
T3 - Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
SP - 251
EP - 259
BT - Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
Y2 - 30 May 2017 through 2 June 2017
ER -