| Original language | English |
|---|---|
| Pages (from-to) | 2655–2658 |
| Journal | Materials Science Forum |
| Volume | 475 |
| State | Published - 2005 |
Electromigration induced metal dissolution in flip-chip solder joints
Yuh Lang Lin, YH Lin, CM Tsai, YC Hu, JY Tsai, CR Kao
Research output: Contribution to journal › Article