Electromigration induced metal dissolution in flip-chip solder joints

Yuh Lang Lin; C. M. Tsai; Y. C. Hu; Yuh Lang Lin; J. Y. Tsai; C. R. Kao

doi:10.4028/0-87849-960-1.2655

Electromigration induced metal dissolution in flip-chip solder joints

Yuh Lang Lin
, C. M. Tsai
, Y. C. Hu
, Yuh Lang Lin
, J. Y. Tsai
, C. R. Kao

Physics

National Central University

Research output: Contribution to journal › Conference article › peer-review

4 Scopus citations

Abstract

The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed. © 2005 Trans Tech Publications, Switzerland.

Original language	English
Pages (from-to)	2655-2658
Number of pages	4
Journal	Materials Science Forum
Volume	475-479
Issue number	IV
DOIs	https://doi.org/10.4028/0-87849-960-1.2655
State	Published - Jan 1 2005
Event	PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing - Beijing, China Duration: Nov 2 2004 → Nov 5 2004

Keywords

Electromigration
Flip-chip
Solder
Thermomigration

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10.4028/0-87849-960-1.2655

Cite this

@article{0143733253594920b469fa1f43d80271,

title = "Electromigration induced metal dissolution in flip-chip solder joints",

abstract = "The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed. {\textcopyright} 2005 Trans Tech Publications, Switzerland.",

keywords = "Electromigration, Flip-chip, Solder, Thermomigration",

author = "Lin, \{Yuh Lang\} and Tsai, \{C. M.\} and Hu, \{Y. C.\} and Lin, \{Yuh Lang\} and Tsai, \{J. Y.\} and Kao, \{C. R.\}",

year = "2005",

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day = "1",

doi = "10.4028/0-87849-960-1.2655",

language = "English",

volume = "475-479",

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issn = "0255-5476",

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note = "PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing ; Conference date: 02-11-2004 Through 05-11-2004",

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TY - JOUR

T1 - Electromigration induced metal dissolution in flip-chip solder joints

AU - Lin, Yuh Lang

AU - Tsai, C. M.

AU - Hu, Y. C.

AU - Lin, Yuh Lang

AU - Tsai, J. Y.

AU - Kao, C. R.

PY - 2005/1/1

Y1 - 2005/1/1

N2 - The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed. © 2005 Trans Tech Publications, Switzerland.

AB - The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed. © 2005 Trans Tech Publications, Switzerland.

KW - Electromigration

KW - Flip-chip

KW - Solder

KW - Thermomigration

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U2 - 10.4028/0-87849-960-1.2655

DO - 10.4028/0-87849-960-1.2655

M3 - Conference article

SN - 0255-5476

VL - 475-479

SP - 2655

EP - 2658

JO - Materials Science Forum

JF - Materials Science Forum

IS - IV

T2 - PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing

Y2 - 2 November 2004 through 5 November 2004

ER -

Electromigration induced metal dissolution in flip-chip solder joints

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Keywords

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