Optical vertical interconnect and integration based on Silicon carrier

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2012 13th International Conference on Electronic Packaging Technology \& High Density Packaging
Pages	97--100
State	Published - 2012

Cite this

@inproceedings{e5444277a96d43fba6d9001fa0e3ac3a,

title = "Optical vertical interconnect and integration based on Silicon carrier",

author = "Fengman Liu and Yanbiao Chu and Baoxia Li and Jian Song and Haidong Wang and Tianmin Du and Binbin Yang and Lixi Wan",

year = "2012",

language = "English",

pages = "97----100",

booktitle = "2012 13th International Conference on Electronic Packaging Technology \textbackslash{}\& High Density Packaging",

}

TY - GEN

T1 - Optical vertical interconnect and integration based on Silicon carrier

AU - Liu, Fengman

AU - Chu, Yanbiao

AU - Li, Baoxia

AU - Song, Jian

AU - Wang, Haidong

AU - Du, Tianmin

AU - Yang, Binbin

AU - Wan, Lixi

PY - 2012

Y1 - 2012

M3 - Conference contribution

SP - 97

EP - 100

BT - 2012 13th International Conference on Electronic Packaging Technology \& High Density Packaging

ER -