Abstract
This report summarizes the studies performed to understand the physical and chemical characteristics of (a) composite filler material, namely boron nitride nanoparticles before and after thermal degradation and (b) pristine slurries and spent CMP waste after polishing of GaAs and HDP oxide films. In addition, this report also provides preliminary determination of half maximal inhibitory concentration (IC50) from the dose-response curves with both pre (pristine) and post (transformed) nanoparticles. Finally, Arsenic speciation results are presented from the analysis of GaAs CMP waste generated by polishing GaAs wafers using colloidal silica nanoparticle based slurry.
| Original language | English |
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| Volume | February |
| State | Published - 2017 |