Program for calculation of flip-chip standoff height

Joshua Ampofo; Richard LaBennett; Stephen Akwaboa; Frederick Ferguson

Program for calculation of flip-chip standoff height

Joshua Ampofo, Richard LaBennett, Stephen Akwaboa, Frederick Ferguson

Research output: Contribution to specialist publication › Article

Abstract

A user-friendly computer program was developed to calculate the key parameters of flip-chip standoff height. The computer program facilitated the easy input of parameters and to perform the solder bump volume and bump height calculations that translated into accurate predictions of flip-chip standoff height. Some of the important parameters were calculated and controlled to ensure repeatable standoff gap within ∓ 1 micro meter. The flip Chip Stand-off Height Calculator can be used to compute the required height of the starting cone shaped solder bump spherical shaped joint.

Original language	English
Pages	42-45
Number of pages	4
Volume	16
No	11
Specialist publication	Circuits Assembly
State	Published - Nov 2005
Externally published	Yes

Cite this

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title = "Program for calculation of flip-chip standoff height",

abstract = "A user-friendly computer program was developed to calculate the key parameters of flip-chip standoff height. The computer program facilitated the easy input of parameters and to perform the solder bump volume and bump height calculations that translated into accurate predictions of flip-chip standoff height. Some of the important parameters were calculated and controlled to ensure repeatable standoff gap within ∓ 1 micro meter. The flip Chip Stand-off Height Calculator can be used to compute the required height of the starting cone shaped solder bump spherical shaped joint.",

author = "Joshua Ampofo and Richard LaBennett and Stephen Akwaboa and Frederick Ferguson",

year = "2005",

month = nov,

language = "English",

volume = "16",

pages = "42--45",

journal = "Circuits Assembly",

issn = "1054-0407",

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T1 - Program for calculation of flip-chip standoff height

AU - Ampofo, Joshua

AU - LaBennett, Richard

AU - Akwaboa, Stephen

AU - Ferguson, Frederick

PY - 2005/11

Y1 - 2005/11

N2 - A user-friendly computer program was developed to calculate the key parameters of flip-chip standoff height. The computer program facilitated the easy input of parameters and to perform the solder bump volume and bump height calculations that translated into accurate predictions of flip-chip standoff height. Some of the important parameters were calculated and controlled to ensure repeatable standoff gap within ∓ 1 micro meter. The flip Chip Stand-off Height Calculator can be used to compute the required height of the starting cone shaped solder bump spherical shaped joint.

AB - A user-friendly computer program was developed to calculate the key parameters of flip-chip standoff height. The computer program facilitated the easy input of parameters and to perform the solder bump volume and bump height calculations that translated into accurate predictions of flip-chip standoff height. Some of the important parameters were calculated and controlled to ensure repeatable standoff gap within ∓ 1 micro meter. The flip Chip Stand-off Height Calculator can be used to compute the required height of the starting cone shaped solder bump spherical shaped joint.

UR - https://www.scopus.com/pages/publications/28044457452

M3 - Article

AN - SCOPUS:28044457452

SN - 1054-0407

VL - 16

SP - 42

EP - 45

JO - Circuits Assembly

JF - Circuits Assembly

ER -

Program for calculation of flip-chip standoff height

Abstract

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