Abstract
A user-friendly computer program was developed to calculate the key parameters of flip-chip standoff height. The computer program facilitated the easy input of parameters and to perform the solder bump volume and bump height calculations that translated into accurate predictions of flip-chip standoff height. Some of the important parameters were calculated and controlled to ensure repeatable standoff gap within ∓ 1 micro meter. The flip Chip Stand-off Height Calculator can be used to compute the required height of the starting cone shaped solder bump spherical shaped joint.
| Original language | English |
|---|---|
| Pages (from-to) | 42-45 |
| Number of pages | 4 |
| Journal | Circuits Assembly |
| Volume | 16 |
| Issue number | 11 |
| State | Published - Nov 1 2005 |