Reliability research on optoelectronics packaging

Fengman Liu; Haiyun Xue; Fei Wan; Fengze Hou; Baoxia Li; Haidong Wang; Binbin Yang; Jian Song; Lixi Wan; Liqiang Cao

Reliability research on optoelectronics packaging

Fengman Liu, Haiyun Xue, Fei Wan, Fengze Hou, Baoxia Li, Haidong Wang, Binbin Yang, Jian Song, Lixi Wan, Liqiang Cao

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2013 14th International Conference on Electronic Packaging Technology
Pages	1061--1063
State	Published - 2013

Cite this

@inproceedings{adb914dcd7b24667b51a219263cebfdc,

title = "Reliability research on optoelectronics packaging",

author = "Fengman Liu and Haiyun Xue and Fei Wan and Fengze Hou and Baoxia Li and Haidong Wang and Binbin Yang and Jian Song and Lixi Wan and Liqiang Cao",

year = "2013",

language = "English",

pages = "1061----1063",

booktitle = "2013 14th International Conference on Electronic Packaging Technology",

}

TY - GEN

T1 - Reliability research on optoelectronics packaging

AU - Liu, Fengman

AU - Xue, Haiyun

AU - Wan, Fei

AU - Hou, Fengze

AU - Li, Baoxia

AU - Wang, Haidong

AU - Yang, Binbin

AU - Song, Jian

AU - Wan, Lixi

AU - Cao, Liqiang

PY - 2013

Y1 - 2013

M3 - Conference contribution

SP - 1061

EP - 1063

BT - 2013 14th International Conference on Electronic Packaging Technology

ER -