Reliability research on optoelectronics packaging

Fengman Liu; Haiyun Xue; Fei Wan; Fengze Hou; Baoxia Li; Haidong Wang; Binbin Yang; Jian Song; Lixi Wan; Liqiang Cao

Reliability research on optoelectronics packaging

Fengman Liu
, Haiyun Xue
, Fei Wan
, Fengze Hou
, Baoxia Li
, Haidong Wang
, Binbin Yang
, Jian Song
, Lixi Wan
, Liqiang Cao

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2013 14th International Conference on Electronic Packaging Technology
Pages	1061--1063
State	Published - 2013

Cite this

@inproceedings{6901da6edcf34b34a2a0908b64a06ac8,

title = "Reliability research on optoelectronics packaging",

author = "Fengman Liu and Haiyun Xue and Fei Wan and Fengze Hou and Baoxia Li and Haidong Wang and Binbin Yang and Jian Song and Lixi Wan and Liqiang Cao",

year = "2013",

language = "English",

pages = "1061----1063",

booktitle = "2013 14th International Conference on Electronic Packaging Technology",

}

TY - GEN

T1 - Reliability research on optoelectronics packaging

AU - Liu, Fengman

AU - Xue, Haiyun

AU - Wan, Fei

AU - Hou, Fengze

AU - Li, Baoxia

AU - Wang, Haidong

AU - Yang, Binbin

AU - Song, Jian

AU - Wan, Lixi

AU - Cao, Liqiang

PY - 2013

Y1 - 2013

M3 - Conference contribution

SP - 1061

EP - 1063

BT - 2013 14th International Conference on Electronic Packaging Technology

ER -