Simultaneous double side grinding of silicon wafers: a literature review

  • ZC Li
  • , Z. J. Pei
  • , Graham R. Fisher

Research output: Contribution to journalArticlepeer-review

49 Scopus citations

Abstract

Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The quality of ICs depends directly on the quality of silicon wafers. A series of processes are required to manufacture high quality silicon wafers. Simultaneous double side grinding (SDSG) is one of the processes to flatten the wire-sawn wafers. This paper reviews the literature on SDSG of silicon wafers, covering the history, machine development (including machine configuration, drive and support systems, and control system), and process modeling (including grinding marks and wafer shape). It also discusses some possible topics for future research. © 2005 Elsevier Ltd. All rights reserved.
Original languageEnglish
Pages (from-to)1449-1458
Number of pages10
JournalInternational Journal of Machine Tools and Manufacture
Volume46
Issue number12-13
DOIs
StatePublished - Oct 1 2006

Keywords

  • Grinding
  • Machining
  • Modeling
  • Semiconductor material
  • Silicon wafer
  • Simultaneous double side grinding

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